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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process
Degryse, D., Vandevelde, B., Stoukatch, S., Beyne, E.Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271630
File:
PDF, 404 KB
english, 2003