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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application
Xueren Zhang,, Tong Yan Tee,, Jing-en Luan,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564716
File:
PDF, 505 KB
english, 2005