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[IEEE 1995 Proceedings. 45th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 1995)] 1995 Proceedings. 45th Electronic Components and Technology Conference - Investigation on the effect of copper leadframe oxidation on package delamination
Chai Tai Chong,, Leslie, A., Lim Thiam Beng,, Lee, C.Year:
1995
Language:
english
DOI:
10.1109/ectc.1995.515322
File:
PDF, 1.19 MB
english, 1995