[IEEE 1991 41st Electronic Components & Technology Conference - Atlanta, GA, USA (11-16 May 1991)] 1991 Proceedings 41st Electronic Components & Technology Conference - PECVD silicon and nitride postbond films for protecting bondpads, bonds and bondwires from corrosion failure
Ulrich, R.K., Brown, W.D., Ang, S.S., Yi, S., Sweet, J., Peterson, D.Year:
1991
Language:
english
DOI:
10.1109/ectc.1991.163962
File:
PDF, 685 KB
english, 1991