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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Silicon Wafer Backside Thinning with Mechanical and Chemical Method for Better Mechanical Property
Jiang, Asen Long Xin, Ming, Lai Chih, Gao, Jeff Chen Yi, Hwee, Tan KimYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359813
File:
PDF, 3.50 MB
english, 2006