[IEEE 2012 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - The effect of NBTI on 3D integrated circuits

Lin, Cheng-Hong, Lu, Yi-Chang, Tang, Chin-Khai, Tsai, Kuen-Yu
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Year:
2012
Language:
english
DOI:
10.1109/edaps.2012.6469435
File:
PDF, 1.02 MB
english, 2012
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