[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Thermo-Mechanical Modeling of Plastic-Core Solder Balls in LTCC/BGA Assemblies
Anttonen, J., Kangasvieri, T., Nousiainen, O., Putaala, J., Vahakangas, J.Year:
2006
Language:
english
DOI:
10.1109/esime.2006.1644003
File:
PDF, 4.16 MB
english, 2006