[IEEE Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Warsaw, Poland (23-26 Oct. 2005)] Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Low temperature snap cure thermoset adhesives with good worklife
Gillissen, S., Nelis, E., van Wuytswinkel, G., de Pater, M., Chih-Min Cheng,, Buffa, V., O'Hara, W., Bo Xia,, Jayesh Shah,Year:
2005
Language:
english
DOI:
10.1109/polytr.2005.1596510
File:
PDF, 3.52 MB
english, 2005