[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Improved PCB via pattern to reduce crosstalk at package BGA region for high speed serial interface
Shim, Yujeong, Oh, DanYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897560
File:
PDF, 3.08 MB
english, 2014