![](/img/cover-not-exists.png)
[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Optimization design for packaging device QFN using a prediction model of the neural-genetic algorithm
Cai, Miao, Yang, Daoguo, Niu, Ligang, Zhao, Mingjun, Chen, WenbinYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270752
File:
PDF, 927 KB
english, 2009