[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Impacts to fine pitch copper wire bonding quality by external airflow
Loh Lee Jeng,, Loh Kian Hwa,, Ng Wen Chang,Year:
2010
Language:
english
DOI:
10.1109/iemt.2010.5746665
File:
PDF, 154 KB
english, 2010