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A novel tube-structure entrapped curing accelerator for prolonging the shelf-life of epoxy resin-based microelectronic packaging material
Zhang, Yong, Cao, Ming, Guo, Guangqing, Sun, Jin, Li, Ze, Xie, Ping, Zhang, Rongben, Fu, PengfeiVolume:
12
Language:
english
Journal:
Journal of Materials Chemistry
DOI:
10.1039/b200475e
Date:
July, 2002
File:
PDF, 282 KB
english, 2002