[IEEE 2011 IEEE 61st Electronic Components and Technology...

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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA

Banijamali, Bahareh, Ramalingam, Suresh, Nagarajan, Kumar, Chaware, Raghu
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Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898527
File:
PDF, 1.14 MB
english, 2011
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