![](/img/cover-not-exists.png)
[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA
Banijamali, Bahareh, Ramalingam, Suresh, Nagarajan, Kumar, Chaware, RaghuYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898527
File:
PDF, 1.14 MB
english, 2011