[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study on reliability of embedded passives in organic substrate
Qiu, Weiyang, Pan, Kailin, Yuan, Chaoping, Wang, JiaopinYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270779
File:
PDF, 1.24 MB
english, 2009