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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A wafer level through-stack-via integration process with one-time bottom-up copper filling
Zhu, Yunhui, Ma, Shenglin, Sun, Xin, Fang, Runiu, Zhong, Xiao, Bian, Yuan, Guan, Yong, Chen, Jing, Miao, Min, Jin, YufengYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897561
File:
PDF, 1.27 MB
english, 2014