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[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Thermal transient test based thermal structure function analysis of IGBT package
Luo, Yafei, Kajita, Yasushi, Hatakeyama, Tomoyuki, Nakagawa, Shinji, Ishizuka, MasaruYear:
2014
Language:
english
DOI:
10.1109/icep.2014.6826749
File:
PDF, 555 KB
english, 2014