[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Investigations on Ru-Mn films as plateable Cu diffusion barriers
Wojcik, Henry, Kaltofen, Rainer, Krien, Cornelia, Merkel, Ulrich, Wenzel, Christian, Bartha, Johann W., Friedemann, Michael, Adolphi, Barbara, Liske, Romy, Neumann, Volker, Geidel, MarionYear:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940262
File:
PDF, 507 KB
english, 2011