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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Vertical metal interconnect thanks to tungsten direct bonding
Di Cioccio, Lea, Gueguen, Pierric, Grouiller, Etienne, Vandroux, Laurent, Delaye, Vincent, Rivoire, Maurice, Lugand, Jean Francois, Clavelier, LaurentYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490643
File:
PDF, 789 KB
english, 2010