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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Copper high volume manufacturing R&D to production
Chylak, Bob, Clauberg, Horst, Foley, John, Qin, Ivy, Milton, BasilYear:
2011
Language:
english
DOI:
10.1109/eptc.2011.6184449
File:
PDF, 2.86 MB
english, 2011