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Nucleation Kinetics and Solidification Temperatures of SnAgCu Interconnections During Reflow Process
Yu, Hao, Kivilahti, Jorma K.Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.885946
Date:
December, 2006
File:
PDF, 534 KB
english, 2006