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[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - A study of self-assembled monolayer coating for non-stick encapsulation mold
Ya-Yu Hsieh,, Hung-Ta Hsu,, Lin, Martin T., Yi-Shao Lai,, Shu-Hui Chen,Year:
2007
Language:
english
DOI:
10.1109/impact.2007.4433596
File:
PDF, 824 KB
english, 2007