[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Development of rigid-flex and multilayer flex for electronic packaging
Das, Rabindra N., Egitto, Frank D., Wilson, Bill, Poliks, Mark D., Markovich, Voya R.Year:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490911
File:
PDF, 1.07 MB
english, 2010