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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - An analysis of the reliability of a wafer level package (WLP) using a silicone under the bump (SUB) configuration
Gonzalez, M., Vandevelde, B., BuIcke, M.V., Winters, C., Beyne, E., Lee, Y.I., Larson, L., HArkness, B.R., Mohamed, M., Meynen, H., Vanlathem, E.Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216391
File:
PDF, 788 KB
english, 2003