A Device-Level Vacuum-Packaging Scheme for Microbolometers...

IEEE Sensors Journal 2007 / 07 Vol. 7; Iss. 7

A Device-Level Vacuum-Packaging Scheme for Microbolometers on Rigid and Flexible Substrates

Mahmood, Aamer, Butler, Donald P., Celik-Butler, Zeynep
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Volume:
7
Language:
english
Journal:
IEEE Sensors Journal
DOI:
10.1109/jsen.2007.896560
Date:
July, 2007
File:
PDF, 468 KB
english, 2007
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