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Analysis of Solder Joint Failure Criteria and Measurement Techniques in the Qualification of Electronic Products
Haiyu Qi,, Vichare, N.M., Azarian, M.H., Pecht, M.Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.921647
Date:
June, 2008
File:
PDF, 1.05 MB
english, 2008