Analysis of Solder Joint Failure Criteria and Measurement...

Analysis of Solder Joint Failure Criteria and Measurement Techniques in the Qualification of Electronic Products

Haiyu Qi,, Vichare, N.M., Azarian, M.H., Pecht, M.
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.921647
Date:
June, 2008
File:
PDF, 1.05 MB
english, 2008
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