[IEEE 2012 3rd IEEE International Workshop on Low...

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[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Adhesive bonding for integrating laser diode and optical isolator

Yokoi, Hideki, Myouenzono, Isamu, Ichishima, Norihiko
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Year:
2012
Language:
english
DOI:
10.1109/ltb-3d.2012.6238057
File:
PDF, 543 KB
english, 2012
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