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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Wafer Backside Coating¿ of Electrically Conductive Die Attach Adhesives for Packaging of Discrete Semiconductor Devices
Winster, Tony, van Rijckevorsel, Hans, Lui, Ben, Zhuo, QizhuoYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763450
File:
PDF, 5.12 MB
english, 2008