[IEEE Symposium on Design, Test, Integration and Packaging...

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[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - A new electroforming technology in aid of pressure for LIGA process

Hsiharng Yang,, Tsung-Shuin Tsai,, Chein, R., Chia-Hua Chang,, Jen-Chin Wu,
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Year:
2003
Language:
english
DOI:
10.1109/dtip.2003.1287052
File:
PDF, 1.24 MB
english, 2003
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