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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - High resolution acoustical imaging of high-density-interconnects for 3D-integration
Brand, Sebastian, Petzold, Matthias, Czurratis, Peter, Reed, Jason D., Lueck, Matthew, Gregory, Chris, Huffman, Alan, Lannon, John M., Temple, Dorota S.Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898488
File:
PDF, 1.78 MB
english, 2011