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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Advanced coreless flip-chip BGA package with high dielectric constant thin film embedded decoupling capacitor
Kim, GaWon, Lee, SeungJae, Yu, JiHeon, Jung, GyuIck, Kim, JinYoung, Karim, Nozard, Yoo, HeeYeoul, Lee, ChoonHeungYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898573
File:
PDF, 1.07 MB
english, 2011