![](/img/cover-not-exists.png)
[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - A novel damage test evaluation of IC bond pad stack strength
Yeo, Alfred, Yong, Eric, Tong, Dan Swee, Reuther, Georg M.Year:
2013
DOI:
10.1109/eptc.2013.6745680
File:
PDF, 535 KB
2013