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[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Power integrity characterization and correlation of 3D package systems using on-chip measurements
Yang, Ling, Kim, Joong-Ho, Oh, Dan, Lan, Hai, Schmitt, RalfYear:
2010
Language:
english
DOI:
10.1109/epeps.2010.5642587
File:
PDF, 439 KB
english, 2010