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[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation
Ikeda, So, Yamamoto, Michitaka, Higurashi, Eiji, Suga, Tadatomo, Oguchi, ToshiakiYear:
2014
Language:
english
DOI:
10.1109/ltb-3d.2014.6886175
File:
PDF, 228 KB
english, 2014