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[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Polymer-based 2D/3D wafer level heterogeneous integration for SSL module
Yuan, Cadmus, Jia Wei,, Huaiyu Ye,, Koh, Sau, Harianto, Stephen, van den Nieuwenhof, Monique, Zhang, G. Q.Year:
2012
Language:
english
DOI:
10.1109/esime.2012.6191808
File:
PDF, 1.38 MB
english, 2012