[IEEE IEEE International Interconnect Technology Conference...

  • Main
  • [IEEE IEEE International Interconnect...

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Novel dissoluble hardmask for damage-less Cu/low-k interconnect fabrication

Furusawa, T., Machida, S., Ryuzaki, D., Sameshima, K., Ishida, T., Ishikawa, K., Miura, N., Konishi, N., Saito, T., Yamaguchi, H.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2003
Language:
english
DOI:
10.1109/iitc.2003.1219752
File:
PDF, 179 KB
english, 2003
Conversion to is in progress
Conversion to is failed