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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Novel dissoluble hardmask for damage-less Cu/low-k interconnect fabrication
Furusawa, T., Machida, S., Ryuzaki, D., Sameshima, K., Ishida, T., Ishikawa, K., Miura, N., Konishi, N., Saito, T., Yamaguchi, H.Year:
2003
Language:
english
DOI:
10.1109/iitc.2003.1219752
File:
PDF, 179 KB
english, 2003