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Electrostatic adhesion testing of thin metallizations
Callahan, D.L., Yang, H., Brotzen, F.R., Griffin, A.J., Dunn, C.F.Volume:
19
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/55.661166
Date:
March, 1998
File:
PDF, 105 KB
english, 1998