[IEEE Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 - Taiwan (5-8 July 2004)] Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) - Failure analysis of IMC cracking and voiding induced by molding compound voids in advanced wire bonding packages
Yian-Liang Kuo,, Lin, Y.-C., Lin, Y.-T., Huan, H.-S., Su, D.Year:
2004
Language:
english
DOI:
10.1109/ipfa.2004.1345603
File:
PDF, 252 KB
english, 2004