[IEEE 2007 IEEE Electrical Performance of Electronic Packaging - Atlanta, GA, USA (2007.10.29-2007.10.31)] 2007 IEEE Electrical Performance of Electronic Packaging - Vertical Differential Pair Routing in High Performance Ceramic Multi-chip Module Packages
Baez, Franklin, Van Dyke, Peter, Spring, ChristopherYear:
2007
Language:
english
DOI:
10.1109/epep.2007.4387167
File:
PDF, 2.90 MB
english, 2007