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[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Intermetallic Growth Behaviour of Gold Ball Bonds Encapsulated with Green Moulding Compounds

Sutiono, S., Seah, A., Chew, S., Calpito, D., Saraswati,, Stephan, D., Wulff, F., Breach, C.D.
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Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614470
File:
PDF, 4.55 MB
english, 2005
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