[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Trace line failure analysis and characterization of the panel base package (PBP™) technology with fan-out capability
Yew, Ming-Chih, Wu, Chung-Jung, Huang, Ching-Shun, Tsai, Mars, Hu, Dyi-Chung, Yang, Wen-Kung, Chiang, Kuo-NingYear:
2008
Language:
english
DOI:
10.1109/itherm.2008.4544356
File:
PDF, 1.92 MB
english, 2008