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[IEEE 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Galati, Romania (2013.10.24-2013.10.27)] 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Influence of filler concentration on frequency dependence of electrically conductive adhesive joints impedance
Mach, Pavel, Placek, MartinYear:
2013
Language:
english
DOI:
10.1109/siitme.2013.6743648
File:
PDF, 368 KB
english, 2013