Methodology for thermal evaluation of multichip modules

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1995 / Dec. Vol. 18; Iss. 4

Methodology for thermal evaluation of multichip modules

Lall, B.S., Guenin, B.N., Molnar, R.J.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.477461
Date:
January, 1995
File:
PDF, 747 KB
english, 1995
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