[IEEE 2014 4th IEEE International Workshop on Low...

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[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Room-temperature wafer bonding with smooth Au thin film in ambient air using Ar RF plasma activation

Okumura, Ken, Higurashi, Eiji, Suga, Tadatomo, Hagiwara, Kei
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Year:
2014
Language:
english
DOI:
10.1109/ltb-3d.2014.6886165
File:
PDF, 403 KB
english, 2014
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