![](/img/cover-not-exists.png)
[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Thermo-compression bonding of electrodes between FPCB and RPCB
Yoon, Jeong-Won, Jin-Kyu Jang,, Jung-Hyun Choi,, Jong-Gun Lee,, Lee, Jong-Bum, Noh, Bo-In, Jung, Seung-BooYear:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702741
File:
PDF, 1.79 MB
english, 2010