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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Wafer-level packaging method incorporating embedded thermal management for GaN-based RF front-ends
Margomenos, A., Herrault, F., Prophet, E., Micovic, M., Yajima, M., Butler, C., Shinohara, K., Brown, D. F., Corrion, A., Kurdoghlian, A., Bowen, R., Wetzel, M., McGuire, C., Grabar, R., Chow, D.H.Year:
2014
Language:
english
DOI:
10.1109/itherm.2014.6892387
File:
PDF, 533 KB
english, 2014