[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Die shear strength as a function of bond frame geometry — Au-Au thermo-compression bonding
Tollefsen, Torleif Andre, Larsson, Andreas, Taklo, Maaike Margrete Visser, Poppe, Erik, Schjolberg-Henriksen, KariYear:
2012
Language:
english
DOI:
10.1109/estc.2012.6542131
File:
PDF, 1.53 MB
english, 2012