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[IEEE 2014 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY (2014.5.19-2014.5.21)] 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) - Successful void free gap fill of 3µm, high AR via middle, Through Silicon Vias at wafer level
Thangaraju, S., England, L., Rabie, M., Zhang, D., Kumarapuram, G., McGowan, R., Selsley, A., Giridharan, R. R., Gu, S., Seshachalam, V., Wang, C., Kakita, S., Baral, S., Kim, W., Edmundson, H.Year:
2014
Language:
english
DOI:
10.1109/asmc.2014.6846976
File:
PDF, 676 KB
english, 2014