[IEEE Digest of Technical Papers.1990 Symposium on VLSI Technology - Honolulu, Hawaii, USA (1990.06.4-1990.06.7)] Digest of Technical Papers.1990 Symposium on VLSI Technology - A manufacturable 2.0 micron pitch three-level-metal interconnect process for high performance 0.8 micron CMOS technology
Peng, S., Hsu, T.S.-H., Ray, G.W., Kuang-Yi Chiu, Kuang-Yi ChiuYear:
1990
Language:
english
DOI:
10.1109/vlsit.1990.110990
File:
PDF, 390 KB
english, 1990