Multiwafer vertical interconnects for three-dimensional integrated circuits
Lahiji, R.R., Herrick, K.J., Yongshik Lee,, Margomenos, A., Mohammadi, S., Katehi, L.P.B.Volume:
54
Language:
english
Journal:
IEEE Transactions on Microwave Theory and Techniques
DOI:
10.1109/tmtt.2006.874867
Date:
June, 2006
File:
PDF, 1.54 MB
english, 2006