Foreword Contributions From Thermal Investigations of ICs and Systems (THERMINIC)
Lasance, C.J.M., Rencz, M.Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2004.843178
Date:
March, 2005
File:
PDF, 271 KB
english, 2005